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1 : $1.4220
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Rochester Electronics CY8C20110-LDX2I
IC CAPSENSE EXP 10 I/O 16QFN
Manufacturer # :CY8C20110-LDX2I
Manufacturer :Rochester Electronics
Dasenic # :CY8C20110-LDX2I-DS
Datasheet :
CY8C20110-LDX2I Datasheet
CY8C20110-LDX2I DatasheetCustomer # :
Description : IC CAPSENSE EXP 10 I/O 16QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.4220 | $ 1.42 |
| 25+ | $ 1.3860 | $ 34.65 |
| 100+ | $ 1.3320 | $ 133.2 |
| 500+ | $ 1.2780 | $ 639 |
| 1000+ | $ 1.2060 | $ 1206 |
In Stock: 5880
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.422
Total :$ 1.42
Delivery :
Payment :
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CY8C20110-LDX2I information
Rochester Electronics CY8C20110-LDX2I technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Sensor, Capacitive Touch
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:16-UFQFN
- Current - Supply:1.5mA
- Type:Buttons
- Interface:I²C
- Supplier Device Package:16-QFN (3x3)
- Resolution:-
- Voltage - Supply:2.4V ~ 5.25V
- Number of Inputs:Up to 10
- Proximity Detection:No
- L E D Driver Channels:Up to 10
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CY8C20110-LDX2I provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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