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1 : $6.8760
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Rochester Electronics CY7C68321C-100AXC
IC USB 2.0 BRIDGE AT2LP 100LQFP
Manufacturer # :CY7C68321C-100AXC
Manufacturer :Rochester Electronics
Dasenic # :CY7C68321C-100AXC-DS
Datasheet :
CY7C68321C-100AXC Datasheet
CY7C68321C-100AXC DatasheetCustomer # :
Description : IC USB 2.0 BRIDGE AT2LP 100LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 6.8760 | $ 6.88 |
| 25+ | $ 6.7410 | $ 168.53 |
| 100+ | $ 6.4620 | $ 646.2 |
| 500+ | $ 6.1920 | $ 3096 |
| 1000+ | $ 5.8410 | $ 5841 |
In Stock: 13677
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.876
Total :$ 6.88
Delivery :
Payment :
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CY7C68321C-100AXC information
Rochester Electronics CY7C68321C-100AXC technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Controllers
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Package / Case:100-LQFP
- Current - Supply:50mA
- Interface:ATA
- Supplier Device Package:100-TQFP (14x20)
- Standards:USB 2.0
- Voltage - Supply:3.15V ~ 3.45V
- Protocol:USB
- Function:Bridge, USB to ATA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY7C68321C-100AXC provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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