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Rochester Electronics CY7C68301B-56PVXC

IC USB 2.0 BRIDGE AT2LP 56-SSOP
part number has RoHS
Manufacturer # :CY7C68301B-56PVXC
Manufacturer :Rochester Electronics
Dasenic # :CY7C68301B-56PVXC-DS
Customer # :
Description : IC USB 2.0 BRIDGE AT2LP 56-SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.4030$ 2.4
25+$ 2.3580$ 58.95
100+$ 2.2590$ 225.9
500+$ 2.1600$ 1080
1000+$ 2.0430$ 2043
In Stock: 6942
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.403
Total :$ 2.40
Delivery :
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Payment :
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  • Rochester Electronics CY7C68301B-56PVXC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Controllers Interface
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Package / Case:56-BSSOP (0.295", 7.50mm Width)
  • Current - Supply:50mA
  • Interface:ATA
  • Supplier Device Package:56-SSOP
  • Standards:USB 2.0
  • Voltage - Supply:3.15V ~ 3.45V
  • Protocol:USB
  • Function:Bridge, USB to ATA
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY7C68301B-56PVXC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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