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Rochester Electronics CY7C64013C-PXC

IC MCU 8K FULL SPEED USB 28DIP
part number has RoHS
Manufacturer # :CY7C64013C-PXC
Manufacturer :Rochester Electronics
Dasenic # :CY7C64013C-PXC-DS
Customer # :
Description : IC MCU 8K FULL SPEED USB 28DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.1500$ 3.15
25+$ 3.0870$ 77.18
100+$ 2.9610$ 296.1
500+$ 2.8350$ 1417.5
1000+$ 2.6820$ 2682
In Stock: 10042
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.15
Total :$ 3.15
Delivery :
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Payment :
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CY7C64013C-PXC information

  • Rochester Electronics CY7C64013C-PXC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:28-DIP (0.300", 7.62mm)
  • Interface:I²C, USB, HAPI
  • Supplier Device Package:28-PDIP
  • Voltage - Supply:4V ~ 5.25V
  • Number of I/ O:19
  • Core Processor:M8C
  • R A M Size:256 x 8
  • Program Memory Type:OTP (8kB)
  • Controller Series:CY7C640xx
  • Applications:USB Microcontroller
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.31.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY7C64013C-PXC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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