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Rochester Electronics CY7C462A-25PTC

FIFO, 16KX9, 25NS, ASYNCHRONOUS
part number has RoHS
Manufacturer # :CY7C462A-25PTC
Manufacturer :Rochester Electronics
Dasenic # :CY7C462A-25PTC-DS
Customer # :
Description : FIFO, 16KX9, 25NS, ASYNCHRONOUS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
36+$ 7.6770$ 276.37
In Stock: 1639
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.677
Total :$ 7.68
Delivery :
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Payment :
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CY7C462A-25PTC information

  • Rochester Electronics CY7C462A-25PTC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:28-DIP (0.600", 15.24mm)
  • Supplier Device Package:28-PDIP
  • Memory Size:16K x 9
  • Voltage - Supply:4.5 V ~ 5.5 V
  • Current - Supply ( Max):60mA
  • Data Rate:28.5MHz
  • Access Time:25ns
  • Bus Directional:Uni-Directional
  • Expansion Type:Depth, Width
  • Programmable Flags Support:No
  • Retransmit Capability:Yes
  • F W F T Support:No
  • Function:Asynchronous
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Affected
  • US ECCN:EAR99
  • HTS US:8542.32.0071
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY7C462A-25PTC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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