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1 : $7.6770
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Rochester Electronics CY7C460A-25PC
FIFO, 8KX9, 25NS, ASYNCHRONOUS
Manufacturer # :CY7C460A-25PC
Manufacturer :Rochester Electronics
Dasenic # :CY7C460A-25PC-DS
Datasheet :
CY7C460A-25PC Datasheet
CY7C460A-25PC DatasheetCustomer # :
Description : FIFO, 8KX9, 25NS, ASYNCHRONOUS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 36+ | $ 7.6770 | $ 276.37 |
In Stock: 1872
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.677
Total :$ 7.68
Delivery :
Payment :
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CY7C460A-25PC information
Rochester Electronics CY7C460A-25PC technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Through Hole
- Package / Case:28-DIP (0.600", 15.24mm)
- Supplier Device Package:28-PDIP
- Memory Size:8K x 9
- Voltage - Supply:4.5 V ~ 5.5 V
- Current - Supply ( Max):60mA
- Data Rate:28.5MHz
- Access Time:25ns
- Bus Directional:Uni-Directional
- Expansion Type:Depth, Width
- Programmable Flags Support:No
- Retransmit Capability:Yes
- F W F T Support:No
- Function:Asynchronous
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.32.0071
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CY7C460A-25PC provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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