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  • Rochester Electronics CY7C4225-15ASXC

    IC SYNC FIFO MEM 1KX18 64LQFP
  • part number has RoHS
  • Mfr.Part # :CY7C4225-15ASXC
  • Manufacturer :Rochester Electronics
  • Dasenic # :CY7C4225-15ASXC-DS
  • Datasheet :pdf download CY7C4225-15ASXC Datasheet
  • Description : IC SYNC FIFO MEM 1KX18 64LQFP
  • Package :-
  • Quantity :
    Unit Price : $ 13.941Total : $ 13.94
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1699
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 13.9410$ 13.94
25 +$ 13.6620$ 341.55
100 +$ 13.1040$ 1310.40
500 +$ 12.5460$ 6273.00
1000 +$ 11.8530$ 11853.00

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Rochester Electronics CY7C4225-15ASXC technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/FIFOs Memory
Product Status:Obsolete
Operating Temperature:0°C ~ 70°C
Mounting Type:Surface Mount
Package / Case:64-LQFP
Supplier Device Package:64-TQFP (14x14)
Memory Size:18K (1K x 18)
Voltage - Supply:4.5 V ~ 5.5 V
Current - Supply ( Max):45mA
Data Rate:66.7MHz
Access Time:10ns
Bus Directional:Uni-Directional
Expansion Type:Depth, Width
Programmable Flags Support:Yes
Retransmit Capability:Yes
F W F T Support:No
Function:Synchronous
EU RoHS Status:ROHS3 Compliant
US ECCN:EAR99
HTS US:8542.32.0071
REACH Status:Vendor is not defined
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY7C4225-15ASXC provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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