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Rochester Electronics CY7C244-55WC
UVPROM, 4KX8, 55NS, CMOS
Manufacturer # :CY7C244-55WC
Manufacturer :Rochester Electronics
Dasenic # :CY7C244-55WC-DS
Datasheet :
CY7C244-55WC Datasheet
CY7C244-55WC DatasheetCustomer # :
Description : UVPROM, 4KX8, 55NS, CMOS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 5.9580 | $ 5.96 |
| 25+ | $ 5.8410 | $ 146.03 |
| 100+ | $ 5.5980 | $ 559.8 |
| 500+ | $ 5.3640 | $ 2682 |
| 1000+ | $ 5.0670 | $ 5067 |
In Stock: 9564
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.958
Total :$ 5.96
Delivery :
Payment :
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CY7C244-55WC information
Rochester Electronics CY7C244-55WC technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:-
- Package / Case:-
- Technology:EPROM - UV
- Supplier Device Package:-
- Memory Size:32Kb (4K x 8)
- Memory Type:Non-Volatile
- Voltage - Supply:4.5V ~ 5.5V
- Clock Frequency:-
- Access Time:55 ns
- Memory Format:EPROM
- Memory Interface:Parallel
- Write Cycle Time - Word, Page:-
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.32.0061
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CY7C244-55WC provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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