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Rochester Electronics CY7C197-15PC

STANDARD SRAM, 256KX1, 15NS
part number has RoHS
Manufacturer # :CY7C197-15PC
Manufacturer :Rochester Electronics
Dasenic # :CY7C197-15PC-DS
Customer # :
Description : STANDARD SRAM, 256KX1, 15NS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.5460$ 3.55
25+$ 3.4740$ 86.85
100+$ 3.3300$ 333
500+$ 3.1860$ 1593
1000+$ 3.0150$ 3015
In Stock: 3252
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.546
Total :$ 3.55
Delivery :
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Payment :
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CY7C197-15PC information

  • Rochester Electronics CY7C197-15PC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:24-DIP (0.300", 7.62mm)
  • Technology:SRAM - Asynchronous
  • Supplier Device Package:24-PDIP
  • Memory Size:256Kb (64K x 4)
  • Memory Type:Volatile
  • Voltage - Supply:4.5V ~ 5.5V
  • Clock Frequency:-
  • Access Time:15 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:15ns
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Affected
  • US ECCN:EAR99
  • HTS US:8542.32.0041
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY7C197-15PC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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