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Rochester Electronics CY7C1360B-200BZC

CACHE SRAM, 256KX36, 3NS
part number has RoHS
Manufacturer # :CY7C1360B-200BZC
Manufacturer :Rochester Electronics
Dasenic # :CY7C1360B-200BZC-DS
Customer # :
Description : CACHE SRAM, 256KX36, 3NS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 8.1810$ 8.18
25+$ 8.0190$ 200.48
100+$ 7.6860$ 768.6
500+$ 7.3620$ 3681
1000+$ 6.9570$ 6957
In Stock: 4212
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.181
Total :$ 8.18
Delivery :
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Payment :
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CY7C1360B-200BZC information

  • Rochester Electronics CY7C1360B-200BZC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Technology:SRAM - Synchronous, SDR
  • Supplier Device Package:165-FBGA (13x15)
  • Memory Size:9Mb (256K x 36)
  • Memory Type:Volatile
  • Voltage - Supply:3.135V ~ 3.6V
  • Clock Frequency:200 MHz
  • Access Time:3 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Affected
  • US ECCN:3A991B2A
  • HTS US:8542.32.0041
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY7C1360B-200BZC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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