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Rochester Electronics CY7C1339B-133BGI

CACHE SRAM, 128KX32, 4NS
part number has RoHS
Manufacturer # :CY7C1339B-133BGI
Manufacturer :Rochester Electronics
Dasenic # :CY7C1339B-133BGI-DS
Customer # :
Description : CACHE SRAM, 128KX32, 4NS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 43.8482$ 43.85
25+$ 42.9609$ 1074.02
100+$ 41.1863$ 4118.63
500+$ 39.4116$ 19705.8
1000+$ 37.2673$ 37267.3
In Stock: 1705
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 43.8482
Total :$ 43.85
Delivery :
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CY7C1339B-133BGI information

  • Rochester Electronics CY7C1339B-133BGI technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:119-BGA
  • Technology:SRAM - Synchronous, SDR
  • Supplier Device Package:119-PBGA (14x22)
  • Memory Size:4Mb (128K x 32)
  • Memory Type:Volatile
  • Voltage - Supply:3.15V ~ 3.6V
  • Clock Frequency:133 MHz
  • Access Time:4 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY7C1339B-133BGI provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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