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Rochester Electronics CY7C1339A-100AC
128KX32 3.3V SYNC-PL SRAM (3.3V
Manufacturer # :CY7C1339A-100AC
Manufacturer :Rochester Electronics
Dasenic # :CY7C1339A-100AC-DS
Datasheet :
CY7C1339A-100AC Datasheet
CY7C1339A-100AC DatasheetCustomer # :
Description : 128KX32 3.3V SYNC-PL SRAM (3.3V
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 89+ | $ 6.8000 | $ 605.2 |
In Stock: 2338
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.8
Total :$ 6.80
Delivery :
Payment :
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CY7C1339A-100AC information
Rochester Electronics CY7C1339A-100AC technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:100-LQFP
- Technology:SRAM - Synchronous, SDR
- Supplier Device Package:100-TQFP (14x20)
- Memory Size:4Mb (128K x 32)
- Memory Type:Volatile
- Voltage - Supply:3.15V ~ 3.6V
- Clock Frequency:100 MHz
- Access Time:8 ns
- Memory Format:SRAM
- Memory Interface:Parallel
- Write Cycle Time - Word, Page:-
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:3A991B2A
- HTS US:8542.32.0041
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CY7C1339A-100AC provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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