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Rochester Electronics CY7C1327A-133ACT

SRAM CHIP SYNC SINGLE 3.3V 4M BI
part number has RoHS
Manufacturer # :CY7C1327A-133ACT
Manufacturer :Rochester Electronics
Dasenic # :CY7C1327A-133ACT-DS
Customer # :
Description : SRAM CHIP SYNC SINGLE 3.3V 4M BI
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 25.9540$ 25.95
25+$ 25.4364$ 635.91
100+$ 24.4012$ 2440.12
500+$ 23.3660$ 11683
1000+$ 22.0350$ 22035
In Stock: 15300
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 25.954
Total :$ 25.95
Delivery :
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Payment :
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CY7C1327A-133ACT information

  • Rochester Electronics CY7C1327A-133ACT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:100-LQFP
  • Technology:SRAM - Synchronous, SDR
  • Supplier Device Package:100-TQFP (14x20)
  • Memory Size:4.5Mb (256K x 18)
  • Memory Type:Volatile
  • Voltage - Supply:3.15V ~ 3.6V
  • Clock Frequency:133 MHz
  • Access Time:4 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY7C1327A-133ACT provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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