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Rochester Electronics CY7B9911-5JC

IC CLK BUFF SKEW 8OUT 32PLCC
part number has RoHS
Manufacturer # :CY7B9911-5JC
Manufacturer :Rochester Electronics
Dasenic # :CY7B9911-5JC-DS
Customer # :
Description : IC CLK BUFF SKEW 8OUT 32PLCC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 8.0280$ 8.03
25+$ 7.8660$ 196.65
In Stock: 1582
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.028
Total :$ 8.03
Delivery :
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Payment :
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CY7B9911-5JC information

  • Rochester Electronics CY7B9911-5JC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:32-LCC (J-Lead)
  • Type:Fanout Buffer (Distribution), Zero Delay Buffer
  • Supplier Device Package:32-PLCC (11.43x13.97)
  • Frequency - Max:100MHz
  • Number of Circuits:1
  • Output:TTL
  • Voltage - Supply:4.5V ~ 5.5V
  • P L L:Yes
  • Input:TTL
  • Ratio - Input: Output:1:8
  • Differential - Input: Output:No/No
  • Divider/ Multiplier:Yes/Yes
  • EU RoHS Status:RoHS non-compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY7B9911-5JC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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