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Rochester Electronics CY74FCT2374TSOC

Name: CY74FCT2374TSOC
Brand: Rochester Electronics
SKU: CY74FCT2374TSOC-DS
Price: 0.1658 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 5100

MOQ: 1

5 Price Tiers

Mfr.Part # :CY74FCT2374TSOC
Manufacturer :Rochester Electronics
Dasenic # :CY74FCT2374TSOC-DS
Datasheet : CY74FCT2374TSOC Datasheet PDF
Description : IC FF D-TYPE SNGL 8BIT 20SOIC
Package :-
Unit Price: $0.1658
Total: $0.17

Quantity	Unit Price	You Save
1-1	$0.1658	-
2-25	$0.1625	2.0% save
26-100	$0.1558	6.0% save
101-500	$0.1492	10.0% save
501-1000	$0.1409	15.0% save

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Rochester Electronics CY74FCT2374TSOC technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Flip Flops

Product Status:Obsolete

Operating Temperature:-40°C ~ 85°C (TA)

Mounting Type:Surface Mount

Package / Case:20-SOIC (0.295", 7.50mm Width)

Type:D-Type

Output Type:Tri-State, Non-Inverted

Supplier Device Package:20-SOIC

Number of Elements:1

Voltage - Supply:4.75V ~ 5.25V

Clock Frequency:250 MHz

Number of Bits per Element:8

Current - Output High, Low:15mA, 12mA

Max Propagation Delay @ V, Max C L:10ns @ 5V, 50pF

Current - Quiescent ( Iq):200 µA

Trigger Type:Positive Edge

Input Capacitance:5 pF

Function:Standard

EU RoHS Status:RoHS Compliant

REACH Status:Vendor is not defined

US ECCN:Provided as per user requirements

China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

CY74FCT2374TSOC provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.