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1 : $1.7190
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Rochester Electronics CY74FCT16841ATPVC
IC 20BIT BUS-INT D LATCH 56SSOP
Manufacturer # :CY74FCT16841ATPVC
Manufacturer :Rochester Electronics
Dasenic # :CY74FCT16841ATPVC-DS
Datasheet :
CY74FCT16841ATPVC Datasheet
CY74FCT16841ATPVC DatasheetCustomer # :
Description : IC 20BIT BUS-INT D LATCH 56SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.7190 | $ 1.72 |
| 25+ | $ 1.6830 | $ 42.08 |
| 100+ | $ 1.6200 | $ 162 |
| 500+ | $ 1.5480 | $ 774 |
| 1000+ | $ 1.4580 | $ 1458 |
In Stock: 5100
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.719
Total :$ 1.72
Delivery :
Payment :
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CY74FCT16841ATPVC information
Rochester Electronics CY74FCT16841ATPVC technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Latches
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:56-BSSOP (0.295", 7.50mm Width)
- Output Type:Tri-State
- Supplier Device Package:56-SSOP
- Voltage - Supply:4.5V ~ 5.5V
- Logic Type:D-Type Transparent Latch
- Current - Output High, Low:32mA, 64mA
- Circuit:10:10
- Independent Circuits:2
- Delay Time - Propagation:1.5ns
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CY74FCT16841ATPVC provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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