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Rochester Electronics CY62147CV30LL-70BAI

STANDARD SRAM, 256KX16, 70NS
part number has RoHS
Manufacturer # :CY62147CV30LL-70BAI
Manufacturer :Rochester Electronics
Dasenic # :CY62147CV30LL-70BAI-DS
Customer # :
Description : STANDARD SRAM, 256KX16, 70NS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.9250$ 2.93
25+$ 2.8710$ 71.78
100+$ 2.7540$ 275.4
500+$ 2.6370$ 1318.5
1000+$ 2.4840$ 2484
In Stock: 1744
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.925
Total :$ 2.92
Delivery :
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Payment :
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CY62147CV30LL-70BAI information

  • Rochester Electronics CY62147CV30LL-70BAI technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TFBGA
  • Technology:SRAM - Asynchronous
  • Supplier Device Package:48-FBGA (7x8.5)
  • Memory Size:4Mb (256K x 16)
  • Memory Type:Volatile
  • Voltage - Supply:2.7V ~ 3.3V
  • Clock Frequency:-
  • Access Time:70 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:70ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY62147CV30LL-70BAI provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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