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Rochester Electronics CY62138CV30LL-55BVIT

STANDARD SRAM, 256KX8, 55NS
part number has RoHS
Manufacturer # :CY62138CV30LL-55BVIT
Manufacturer :Rochester Electronics
Dasenic # :CY62138CV30LL-55BVIT-DS
Customer # :
Description : STANDARD SRAM, 256KX8, 55NS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 10.4999$ 10.5
25+$ 10.2781$ 256.95
100+$ 9.8344$ 983.44
500+$ 9.4647$ 4732.35
1000+$ 8.9471$ 8947.1
In Stock: 12000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.4999
Total :$ 10.50
Delivery :
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Payment :
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CY62138CV30LL-55BVIT information

  • Rochester Electronics CY62138CV30LL-55BVIT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:36-VFBGA
  • Technology:SRAM - Asynchronous
  • Supplier Device Package:36-VFBGA (6x8)
  • Memory Size:2Mb (256K x 8)
  • Memory Type:Volatile
  • Voltage - Supply:2.7V ~ 3.3V
  • Clock Frequency:-
  • Access Time:55 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:55ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY62138CV30LL-55BVIT provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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