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Rochester Electronics CY62136VLL-55BAI

STANDARD SRAM, 128KX16
part number has RoHS
Manufacturer # :CY62136VLL-55BAI
Manufacturer :Rochester Electronics
Dasenic # :CY62136VLL-55BAI-DS
Customer # :
Description : STANDARD SRAM, 128KX16
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
7+$ 0.3979$ 2.79
10+$ 0.3899$ 3.9
100+$ 0.3779$ 37.79
500+$ 0.3660$ 183
1000+$ 0.3580$ 358
In Stock: 47672
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3979
Total :$ 0.40
Delivery :
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Payment :
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CY62136VLL-55BAI information

  • Rochester Electronics CY62136VLL-55BAI technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TFBGA
  • Technology:SRAM - Asynchronous
  • Supplier Device Package:48-FBGA (7x7)
  • Memory Size:2Mb (128K x 16)
  • Memory Type:Volatile
  • Voltage - Supply:2.7V ~ 3.6V
  • Clock Frequency:-
  • Access Time:55 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:55ns
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Affected
  • US ECCN:3A991B2A
  • HTS US:8542.32.0041
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY62136VLL-55BAI provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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