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Rochester Electronics CY62127DV30LL-70ZI
Manufacturer # :CY62127DV30LL-70ZI
Manufacturer :Rochester Electronics
Dasenic # :CY62127DV30LL-70ZI-DS
Datasheet : CY62127DV30LL-70ZI Datasheet
Customer # :
Description : STANDARD SRAM, 64KX16, 70NS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6750
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.323
Total :$ 1.32
Delivery :
Payment :
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CY62127DV30LL-70ZI information
Rochester Electronics CY62127DV30LL-70ZI technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:44-TSOP (0.400", 10.16mm Width)
- Technology:SRAM - Asynchronous
- Supplier Device Package:44-TSOP II
- Memory Size:1Mb (64K x 16)
- Memory Type:Volatile
- Voltage - Supply:2.2V ~ 3.6V
- Clock Frequency:-
- Access Time:70 ns
- Memory Format:SRAM
- Memory Interface:Parallel
- Write Cycle Time - Word, Page:70ns
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CY62127DV30LL-70ZI provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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