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Rochester Electronics CY37192VP160-66AXC

IC CPLD 192MC 20NS 160LQFP
part number has RoHS
Manufacturer # :CY37192VP160-66AXC
Manufacturer :Rochester Electronics
Dasenic # :CY37192VP160-66AXC-DS
Customer # :
Description : IC CPLD 192MC 20NS 160LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 16.0020$ 16
25+$ 15.6780$ 391.95
100+$ 15.0390$ 1503.9
500+$ 14.4000$ 7200
1000+$ 13.5990$ 13599
In Stock: 1522
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 16.002
Total :$ 16.00
Delivery :
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CY37192VP160-66AXC information

  • Rochester Electronics CY37192VP160-66AXC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:160-LQFP
  • Supplier Device Package:160-TQFP (24x24)
  • Programmable Type:In-System Reprogrammable™ (ISR™) CMOS
  • Delay Time tpd(1) Max:20 ns
  • Voltage Supply - Internal:3V ~ 3.6V
  • Number of Logic Elements/ Blocks:-
  • Number of Macrocells:192
  • Number of I/ O:125
  • Number of gates:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY37192VP160-66AXC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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