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Rochester Electronics CY2PD817ZC

LOW SKEW CLOCK DRIVER
part number has RoHS
Manufacturer # :CY2PD817ZC
Manufacturer :Rochester Electronics
Dasenic # :CY2PD817ZC-DS
Customer # :
Description : LOW SKEW CLOCK DRIVER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 6.8760$ 6.88
25+$ 6.7410$ 168.53
100+$ 6.4620$ 646.2
500+$ 6.1920$ 3096
1000+$ 5.8410$ 5841
In Stock: 11409
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.876
Total :$ 6.88
Delivery :
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Payment :
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CY2PD817ZC information

  • Rochester Electronics CY2PD817ZC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:0°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TSSOP (0.173", 4.40mm Width)
  • Type:Fanout Buffer (Distribution)
  • Supplier Device Package:24-TSSOP
  • Frequency - Max:320 MHz
  • Number of Circuits:1
  • Output:LVCMOS, LVPECL, LVTTL
  • Voltage - Supply:2.375V ~ 2.625V
  • Input:LVPECL
  • Ratio - Input: Output:1:7
  • Differential - Input: Output:Yes/Yes
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Affected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY2PD817ZC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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