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Rochester Electronics CY2DP818ZI

LOW SKEW CLOCK DRIVER
part number has RoHS
Manufacturer # :CY2DP818ZI
Manufacturer :Rochester Electronics
Dasenic # :CY2DP818ZI-DS
Customer # :
Description : LOW SKEW CLOCK DRIVER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.1850$ 4.19
25+$ 4.1040$ 102.6
100+$ 3.9330$ 393.3
500+$ 3.7710$ 1885.5
1000+$ 3.5550$ 3555
In Stock: 11411
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.185
Total :$ 4.18
Delivery :
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Payment :
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CY2DP818ZI information

  • Rochester Electronics CY2DP818ZI technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:38-TFSOP (0.173", 4.40mm Width)
  • Type:Fanout Buffer (Distribution)
  • Supplier Device Package:38-TSSOP
  • Frequency - Max:350 MHz
  • Number of Circuits:1
  • Output:LVPECL
  • Voltage - Supply:3.135V ~ 3.465V
  • Input:LVDS, LVPECL, LVTTL
  • Ratio - Input: Output:1:8
  • Differential - Input: Output:Yes/Yes
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Affected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY2DP818ZI provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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