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Rochester Electronics CY2DP1502ZXI

IC CLK BUFFER 1:2 1.5GHZ 8TSSOP
part number has RoHS
Manufacturer # :CY2DP1502ZXI
Manufacturer :Rochester Electronics
Dasenic # :CY2DP1502ZXI-DS
Customer # :
Description : IC CLK BUFFER 1:2 1.5GHZ 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 10.5210$ 10.52
25+$ 10.3140$ 257.85
100+$ 9.8910$ 989.1
500+$ 9.4680$ 4734
1000+$ 8.9460$ 8946
In Stock: 5646
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.521
Total :$ 10.52
Delivery :
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Payment :
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CY2DP1502ZXI information

  • Rochester Electronics CY2DP1502ZXI technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP (0.173", 4.40mm Width)
  • Type:Fanout Buffer (Distribution)
  • Supplier Device Package:8-TSSOP
  • Frequency - Max:1.5 GHz
  • Number of Circuits:1
  • Output:LVPECL
  • Voltage - Supply:2.375V ~ 3.465V
  • Input:CML, HCSL, LVDS, LVPECL
  • Ratio - Input: Output:1:2
  • Differential - Input: Output:Yes/Yes
  • EU RoHS Status:ROHS3 Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY2DP1502ZXI provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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