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Rochester Electronics CY29949AI

LOW SKEW CLOCK DRIVER
part number has RoHS
Manufacturer # :CY29949AI
Manufacturer :Rochester Electronics
Dasenic # :CY29949AI-DS
Customer # :
Description : LOW SKEW CLOCK DRIVER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 5.8320$ 5.83
25+$ 5.7150$ 142.88
100+$ 5.4810$ 548.1
500+$ 5.2470$ 2623.5
1000+$ 4.9590$ 4959
In Stock: 9129
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.832
Total :$ 5.83
Delivery :
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Payment :
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CY29949AI information

  • Rochester Electronics CY29949AI technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:52-TQFP
  • Type:Fanout Buffer (Distribution), Divider, Multiplexer
  • Supplier Device Package:52-TQFP (10x10)
  • Frequency - Max:200 MHz
  • Number of Circuits:1
  • Output:LVCMOS, LVTTL
  • Voltage - Supply:2.375V ~ 2.625V, 2.97V ~ 3.63V
  • Input:LVCMOS, LVPECL, LVTTL
  • Ratio - Input: Output:2:15
  • Differential - Input: Output:Yes/Yes
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Affected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY29949AI provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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