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Rochester Electronics CY28352OC

DDR ZDB BUFFER FOR SIS CHIPSET
part number has RoHS
Manufacturer # :CY28352OC
Manufacturer :Rochester Electronics
Dasenic # :CY28352OC-DS
Customer # :
Description : DDR ZDB BUFFER FOR SIS CHIPSET
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.3670$ 2.37
25+$ 2.3220$ 58.05
100+$ 2.2230$ 222.3
500+$ 2.1330$ 1066.5
1000+$ 2.0160$ 2016
In Stock: 1591
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.367
Total :$ 2.37
Delivery :
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Payment :
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CY28352OC information

  • Rochester Electronics CY28352OC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:28-SSOP (0.209", 5.30mm Width)
  • Type:Buffer/Driver
  • Supplier Device Package:28-SSOP
  • Frequency - Max:200 MHz
  • Number of Circuits:1
  • Output:Clock
  • Voltage - Supply:2.375V ~ 2.625V
  • Input:Clock
  • Ratio - Input: Output:2:6
  • Differential - Input: Output:No/Yes
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY28352OC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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