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1 : $44.2179
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Rochester Electronics CY27H010-35WC
UVPROM, 128KX8, 35NS CDIP32
Manufacturer # :CY27H010-35WC
Manufacturer :Rochester Electronics
Dasenic # :CY27H010-35WC-DS
Datasheet :
CY27H010-35WC Datasheet
CY27H010-35WC DatasheetCustomer # :
Description : UVPROM, 128KX8, 35NS CDIP32
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 44.2179 | $ 44.22 |
| 25+ | $ 43.3306 | $ 1083.27 |
| 100+ | $ 41.5560 | $ 4155.6 |
| 500+ | $ 39.7813 | $ 19890.65 |
| 1000+ | $ 37.5631 | $ 37563.1 |
In Stock: 5088
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 44.2179
Total :$ 44.22
Delivery :
Payment :
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CY27H010-35WC information
Rochester Electronics CY27H010-35WC technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Through Hole
- Package / Case:32-CDIP (0.600", 15.24mm)
- Technology:EPROM - UV
- Supplier Device Package:32-CDIP
- Memory Size:1Mb (128K x 8)
- Memory Type:Non-Volatile
- Voltage - Supply:4.5V ~ 5.5V
- Clock Frequency:-
- Access Time:35 ns
- Memory Format:EPROM
- Memory Interface:Parallel
- Write Cycle Time - Word, Page:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CY27H010-35WC provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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