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Rochester Electronics CY27C010-90WC

UVPROM, 128KX8, 90NS CDIP32
part number has RoHS
Manufacturer # :CY27C010-90WC
Manufacturer :Rochester Electronics
Dasenic # :CY27C010-90WC-DS
Customer # :
Description : UVPROM, 128KX8, 90NS CDIP32
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.2965$ 1.3
100+$ 1.2317$ 123.17
1000+$ 1.1280$ 1128
10000+$ 0.9335$ 9335
In Stock: 40864
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.2965
Total :$ 1.30
Delivery :
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CY27C010-90WC information

  • Rochester Electronics CY27C010-90WC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:28-CDIP (0.600", 15.24mm) Window
  • Technology:EPROM - UV
  • Supplier Device Package:28-CERDIP
  • Memory Size:1Mb (128K x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:4.5V ~ 5.5V
  • Clock Frequency:-
  • Access Time:90 ns
  • Memory Format:EPROM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8542.32.0061
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY27C010-90WC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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