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Rochester Electronics CY2310ANZPVXC-1

IC CLK BUFF 10OUT SDRAM 28SSOP
part number has RoHS
Manufacturer # :CY2310ANZPVXC-1
Manufacturer :Rochester Electronics
Dasenic # :CY2310ANZPVXC-1-DS
Customer # :
Description : IC CLK BUFF 10OUT SDRAM 28SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.8780$ 4.88
25+$ 4.7790$ 119.48
100+$ 4.5810$ 458.1
500+$ 4.3920$ 2196
1000+$ 4.1490$ 4149
In Stock: 3261
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.878
Total :$ 4.88
Delivery :
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Payment :
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CY2310ANZPVXC-1 information

  • Rochester Electronics CY2310ANZPVXC-1 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Application Specific
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:28-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package:28-SSOP
  • Frequency - Max:100MHz
  • Number of Circuits:1
  • Output:LVCMOS
  • Voltage - Supply:3.135V ~ 3.465V
  • P L L:No
  • Input:LVCMOS, LVTTL
  • Ratio - Input: Output:1:10
  • Differential - Input: Output:No/No
  • Main Purpose:Intel CPU, SRAM SO-DIMMs
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY2310ANZPVXC-1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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