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1 : $2.5830
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Rochester Electronics CY2309SI-1HT
IC CLK ZERO DLAY BUFF 1:9 16SOIC
Manufacturer # :CY2309SI-1HT
Manufacturer :Rochester Electronics
Dasenic # :CY2309SI-1HT-DS
Datasheet :
CY2309SI-1HT Datasheet
CY2309SI-1HT DatasheetCustomer # :
Description : IC CLK ZERO DLAY BUFF 1:9 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.5830 | $ 2.58 |
| 25+ | $ 2.5290 | $ 63.23 |
| 100+ | $ 2.4210 | $ 242.1 |
| 500+ | $ 2.3220 | $ 1161 |
| 1000+ | $ 2.1960 | $ 2196 |
In Stock: 11154
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.583
Total :$ 2.58
Delivery :
Payment :
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CY2309SI-1HT information
Rochester Electronics CY2309SI-1HT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
- Product Status:Active
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Type:Zero Delay Buffer
- Supplier Device Package:16-SOIC
- Frequency - Max:-
- Number of Circuits:-
- Output:-
- Voltage - Supply:-
- Input:-
- Ratio - Input: Output:1:9
- Differential - Input: Output:-
- EU RoHS Status:RoHS non-compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY2309SI-1HT provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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