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1 : $18.4050

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Rochester Electronics CY2308SXI-4

IC CLK ZDB 8OUT 133MHZ 16SOIC
part number has RoHS
Manufacturer # :CY2308SXI-4
Manufacturer :Rochester Electronics
Dasenic # :CY2308SXI-4-DS
Customer # :
Description : IC CLK ZDB 8OUT 133MHZ 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1 +$ 18.4050$ 18.41
25 +$ 18.0360$ 450.9
100 +$ 17.2980$ 1729.8
500 +$ 16.5690$ 8284.5
1000 +$ 15.6420$ 15642
In Stock: 7617
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 18.405
Total :$ 18.41
Delivery :
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Payment :
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  • Rochester Electronics CY2308SXI-4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock Generators, PLLs, Frequency Synthesizers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.154", 3.90mm Width)
  • Type:Fanout Buffer (Distribution), Zero Delay Buffer
  • Supplier Device Package:16-SOIC
  • Frequency - Max:133.3MHz
  • Number of Circuits:1
  • Output:LVCMOS
  • Voltage - Supply:3V ~ 3.6V
  • P L L:Yes
  • Input:LVCMOS, LVTTL
  • Ratio - Input: Output:1:8
  • Differential - Input: Output:No/No
  • Divider/ Multiplier:No/Yes
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY2308SXI-4 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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