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Rochester Electronics CY2305CSXA-1
IC CLK ZDB 5OUT 133MHZ 8SOIC
Manufacturer # :CY2305CSXA-1
Manufacturer :Rochester Electronics
Dasenic # :CY2305CSXA-1-DS
Datasheet :
CY2305CSXA-1 Datasheet
CY2305CSXA-1 DatasheetCustomer # :
Description : IC CLK ZDB 5OUT 133MHZ 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 194+ | $ 5.2763 | $ 1023.6 |
In Stock: 506
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.2763
Total :$ 5.28
Delivery :
Payment :
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CY2305CSXA-1 information
Rochester Electronics CY2305CSXA-1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Type:Fanout Buffer (Distribution), Zero Delay Buffer
- Supplier Device Package:8-SOIC
- Frequency - Max:133.33MHz
- Number of Circuits:1
- Output:LVCMOS
- Voltage - Supply:3V ~ 3.6V
- P L L:Yes
- Input:LVCMOS, LVTTL
- Ratio - Input: Output:1:5
- Differential - Input: Output:No/No
- Divider/ Multiplier:No/No
- EU RoHS Status:ROHS3 Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY2305CSXA-1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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