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1 : $11.1060
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Rochester Electronics CS8401A-IS
DIGITAL AUDIO INTERFACE TRANS
Manufacturer # :CS8401A-IS
Manufacturer :Rochester Electronics
Dasenic # :CS8401A-IS-DS
Datasheet :
CS8401A-IS Datasheet
CS8401A-IS DatasheetCustomer # :
Description : DIGITAL AUDIO INTERFACE TRANS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 11.1060 | $ 11.11 |
| 25+ | $ 10.8810 | $ 272.03 |
| 100+ | $ 10.4400 | $ 1044 |
| 500+ | $ 9.9990 | $ 4999.5 |
| 1000+ | $ 9.4410 | $ 9441 |
In Stock: 3084
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.106
Total :$ 11.11
Delivery :
Payment :
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CS8401A-IS information
Rochester Electronics CS8401A-IS technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Audio Special Purpose
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:24-SOIC (0.295", 7.50mm Width)
- Number of Channels:2
- Interface:Serial
- Specifications:-
- Supplier Device Package:24-SOIC
- Voltage - Supply:4.5V ~ 5.5V
- Applications:Audio Systems
- Function:Audio Transmitter
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CS8401A-IS provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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