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1 : $22.1850
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Rochester Electronics CS61884-IB
OCTAL T1/E1/J1 LINE INTERFACE
Manufacturer # :CS61884-IB
Manufacturer :Rochester Electronics
Dasenic # :CS61884-IB-DS
Datasheet :
CS61884-IB Datasheet
CS61884-IB DatasheetCustomer # :
Description : OCTAL T1/E1/J1 LINE INTERFACE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 22.1850 | $ 22.19 |
| 25+ | $ 21.7440 | $ 543.6 |
| 100+ | $ 20.8530 | $ 2085.3 |
| 500+ | $ 19.9710 | $ 9985.5 |
| 1000+ | $ 18.8550 | $ 18855 |
In Stock: 8217
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 22.185
Total :$ 22.18
Delivery :
Payment :
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CS61884-IB information
Rochester Electronics CS61884-IB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:160-LBGA
- Current - Supply:-
- Interface:E1, J1, T1
- Supplier Device Package:160-LFBGA (15x15)
- Number of Circuits:8
- Power ( Watts):1.73 W
- Voltage - Supply:3.135V ~ 3.465V
- Function:Line Interface Unit (LIU)
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CS61884-IB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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