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1 : $27.4600
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Rochester Electronics CS61577-IL1
CS61577 - T1/ E1 LINE INTERFACE
Manufacturer # :CS61577-IL1
Manufacturer :Rochester Electronics
Dasenic # :CS61577-IL1-DS
Datasheet :
CS61577-IL1 Datasheet
CS61577-IL1 DatasheetCustomer # :
Description : CS61577 - T1/ E1 LINE INTERFACE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 27.4600 | $ 27.46 |
| 25+ | $ 26.9200 | $ 673 |
| 100+ | $ 25.8200 | $ 2582 |
| 500+ | $ 24.7200 | $ 12360 |
| 1000+ | $ 23.3400 | $ 23340 |
In Stock: 1518
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 27.46
Total :$ 27.46
Delivery :
Payment :
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CS61577-IL1 information
Rochester Electronics CS61577-IL1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:28-LCC (J-Lead)
- Current - Supply:-
- Interface:E1, T1
- Supplier Device Package:28-PLCC (11.51x11.51)
- Number of Circuits:1
- Power ( Watts):500 mW
- Voltage - Supply:4.75V ~ 5.25V
- Function:Line Interface Unit (LIU)
- EU RoHS Status:RoHS non-compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CS61577-IL1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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