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Rochester Electronics CS4340-KSZ
IC DAC/AUDIO 24BIT 96K 16SOIC
Manufacturer # :CS4340-KSZ
Manufacturer :Rochester Electronics
Dasenic # :CS4340-KSZ-DS
Datasheet :
CS4340-KSZ Datasheet
CS4340-KSZ DatasheetCustomer # :
Description : IC DAC/AUDIO 24BIT 96K 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.0070 | $ 2.01 |
| 25+ | $ 1.9710 | $ 49.28 |
| 100+ | $ 1.8900 | $ 189 |
| 500+ | $ 1.8090 | $ 904.5 |
| 1000+ | $ 1.7100 | $ 1710 |
In Stock: 13662
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.007
Total :$ 2.01
Delivery :
Payment :
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CS4340-KSZ information
Rochester Electronics CS4340-KSZ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Obsolete
- Operating Temperature:-10°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Type:DAC, Audio
- Number of Channels:2
- Supplier Device Package:16-SOIC
- Voltage - Supply:2.7V ~ 3.6V, 5V
- Resolution ( Bits):24 b
- Sampling Rate ( Per Second):96k
- Data Interface:SPI
- Voltage Supply Source:Single Supply
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CS4340-KSZ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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