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Rochester Electronics CG80C286-16

HIGH PERFORMANCE MICROPROCESSOR,
part number has RoHS
Manufacturer # :CG80C286-16
Manufacturer :Rochester Electronics
Dasenic # :CG80C286-16-DS
Customer # :
Description : HIGH PERFORMANCE MICROPROCESSOR,
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 54.7200$ 54.72
25+$ 53.6200$ 1340.5
100+$ 51.4400$ 5144
500+$ 49.2400$ 24620
1000+$ 46.5200$ 46520
In Stock: 1501
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 54.72
Total :$ 54.72
Delivery :
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Payment :
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CG80C286-16 information

  • Rochester Electronics CG80C286-16 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microprocessors
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Package / Case:68-BCPGA
  • Supplier Device Package:68-CPGA (29.47x29.47)
  • Voltage - I/ O:5V
  • Speed:16MHz
  • Core Processor:80C286
  • Number of Cores/ Bus Width:-
  • Co- Processors/ D S P:-
  • R A M Controllers:-
  • Graphics Acceleration:-
  • Display & Interface Controllers:-
  • Ethernet:-
  • S A T A:-
  • U S B:-
  • Security Features:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CG80C286-16 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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