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1 : $12.8800
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Rochester Electronics CDP1879E
CMOS REAL-TIME CLOCK
Manufacturer # :CDP1879E
Manufacturer :Rochester Electronics
Dasenic # :CDP1879E-DS
Datasheet :
CDP1879E Datasheet
CDP1879E DatasheetCustomer # :
Description : CMOS REAL-TIME CLOCK
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 12.8800 | $ 12.88 |
| 25+ | $ 12.6200 | $ 315.5 |
| 100+ | $ 12.1000 | $ 1210 |
| 500+ | $ 11.5800 | $ 5790 |
| 1000+ | $ 10.9400 | $ 10940 |
In Stock: 1511
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.88
Total :$ 12.88
Delivery :
Payment :
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CDP1879E information
Rochester Electronics CDP1879E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Real Time Clocks
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Alarm, Leap Year
- Mounting Type:Through Hole
- Package / Case:24-DIP (0.600", 15.24mm)
- Type:Clock/Calendar
- Interface:-
- Supplier Device Package:24-PDIP
- Memory Size:-
- Voltage - Supply:4V ~ 10.5V
- Time Format:HH:MM:SS (12/24 hr)
- Date Format:YY-MM-DD
- Voltage - Supply, Battery:-
- Current - Timekeeping ( Max):200µA @ 10V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CDP1879E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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