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1 : $5.4900
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Rochester Electronics CDP1852E
BYTE-WIDE INPUT/OUTPUT PORT
Manufacturer # :CDP1852E
Manufacturer :Rochester Electronics
Dasenic # :CDP1852E-DS
Datasheet :
CDP1852E Datasheet
CDP1852E DatasheetCustomer # :
Description : BYTE-WIDE INPUT/OUTPUT PORT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 5.4900 | $ 5.49 |
| 25+ | $ 5.3820 | $ 134.55 |
| 100+ | $ 5.1570 | $ 515.7 |
| 500+ | $ 4.9410 | $ 2470.5 |
| 1000+ | $ 4.6710 | $ 4671 |
In Stock: 3519
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.49
Total :$ 5.49
Delivery :
Payment :
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CDP1852E information
Rochester Electronics CDP1852E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - I/O Expanders
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Features:-
- Mounting Type:Through Hole
- Package / Case:24-DIP (0.600", 15.24mm)
- Output Type:-
- Interface:Parallel
- Supplier Device Package:24-PDIP
- Voltage - Supply:4V ~ 10.5V
- Number of I/ O:8
- Interrupt Output:No
- Current - Output Source/ Sink:6mA
- Clock Frequency:-
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CDP1852E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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