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Rochester Electronics CDCVF111FN

IC CLK BUFFER 1:9 650MHZ 28PLCC
part number has RoHS
Manufacturer # :CDCVF111FN
Manufacturer :Rochester Electronics
Dasenic # :CDCVF111FN-DS
Customer # :
Description : IC CLK BUFFER 1:9 650MHZ 28PLCC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 13.2840$ 13.28
25+$ 13.0140$ 325.35
100+$ 12.4830$ 1248.3
500+$ 11.9520$ 5976
1000+$ 11.2950$ 11295
In Stock: 18049
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 13.284
Total :$ 13.28
Delivery :
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Payment :
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CDCVF111FN information

  • Rochester Electronics CDCVF111FN technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:28-LCC (J-Lead)
  • Type:Fanout Buffer (Distribution)
  • Supplier Device Package:28-PLCC (11.51x11.51)
  • Frequency - Max:650 MHz
  • Number of Circuits:1
  • Output:LVPECL
  • Voltage - Supply:3V ~ 3.6V
  • Input:LVPECL
  • Ratio - Input: Output:1:9
  • Differential - Input: Output:Yes/Yes
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CDCVF111FN provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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