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Rochester Electronics CDCLVP111VF

IC CLK BUFFER 2:10 3.5GHZ 32LQFP
part number has RoHS
Manufacturer # :CDCLVP111VF
Manufacturer :Rochester Electronics
Dasenic # :CDCLVP111VF-DS
Customer # :
Description : IC CLK BUFFER 2:10 3.5GHZ 32LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 6.7576$ 67.58
250+$ 5.6313$ 1407.83
500+$ 5.4684$ 2734.2
1000+$ 5.3460$ 5346
In Stock: 4500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.7576
Total :$ 6.76
Delivery :
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Payment :
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CDCLVP111VF information

  • Rochester Electronics CDCLVP111VF technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-LQFP
  • Type:Fanout Buffer (Distribution), Multiplexer
  • Supplier Device Package:32-LQFP (7x7)
  • Frequency - Max:3.5 GHz
  • Number of Circuits:1
  • Output:LVPECL
  • Voltage - Supply:2.375V ~ 3.8V
  • Input:CML, LVDS, LVPECL, SSTL
  • Ratio - Input: Output:2:10
  • Differential - Input: Output:Yes/Yes
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CDCLVP111VF provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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