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1 : $8.7390
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Rochester Electronics CDC208NS
IC CLK BUFFER 1:4 60MHZ 20SO
Manufacturer # :CDC208NS
Manufacturer :Rochester Electronics
Dasenic # :CDC208NS-DS
Datasheet :
CDC208NS Datasheet
CDC208NS DatasheetCustomer # :
Description : IC CLK BUFFER 1:4 60MHZ 20SO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 8.7390 | $ 8.74 |
| 25+ | $ 8.5680 | $ 214.2 |
| 100+ | $ 8.2170 | $ 821.7 |
| 500+ | $ 7.8660 | $ 3933 |
| 1000+ | $ 7.4250 | $ 7425 |
In Stock: 8436
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.739
Total :$ 8.74
Delivery :
Payment :
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CDC208NS information
Rochester Electronics CDC208NS technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:20-SOIC (0.209", 5.30mm Width)
- Type:Fanout Buffer (Distribution)
- Supplier Device Package:20-SO
- Frequency - Max:60 MHz
- Number of Circuits:2
- Output:CMOS
- Voltage - Supply:4.5V ~ 5.5V
- Input:TTL
- Ratio - Input: Output:1:4
- Differential - Input: Output:No/No
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CDC208NS provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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