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Rochester Electronics CD74HC190NS

IC BCD UP/DWN COUNTR PREST 16SO
part number has RoHS
Manufacturer # :CD74HC190NS
Manufacturer :Rochester Electronics
Dasenic # :CD74HC190NS-DS
Customer # :
Description : IC BCD UP/DWN COUNTR PREST 16SO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 9.2429$ 9.24
25+$ 9.0210$ 225.53
100+$ 8.6513$ 865.13
500+$ 8.2816$ 4140.8
1000+$ 7.8380$ 7838
In Stock: 11850
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.2429
Total :$ 9.24
Delivery :
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Payment :
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CD74HC190NS information

  • Rochester Electronics CD74HC190NS technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Counters, Dividers
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.209", 5.30mm Width)
  • Direction:Up, Down
  • Supplier Device Package:16-SO
  • Number of Elements:1
  • Voltage - Supply:2 V ~ 6 V
  • Logic Type:Counter, Decade
  • Number of Bits per Element:4
  • Reset:-
  • Timing:Synchronous
  • Count Rate:35 MHz
  • Trigger Type:Positive Edge
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CD74HC190NS provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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