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Rochester Electronics CD54HC173F3A
Manufacturer # :CD54HC173F3A
Manufacturer :Rochester Electronics
Dasenic # :CD54HC173F3A-DS
Datasheet : CD54HC173F3A Datasheet
Customer # :
Description : D FLIP-FLOP, HC/UH SERIES, 4-BIT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1520
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 29.44
Total :$ 29.44
Delivery :
Payment :
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CD54HC173F3A information
Rochester Electronics CD54HC173F3A technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C (TA)
- Mounting Type:Through Hole
- Package / Case:16-CDIP (0.300", 7.62mm)
- Type:D-Type
- Output Type:Tri-State, Non-Inverted
- Supplier Device Package:16-CDIP
- Number of Elements:1
- Voltage - Supply:2V ~ 6V
- Clock Frequency:60 MHz
- Number of Bits per Element:4
- Current - Output High, Low:7.8mA, 7.8mA
- Max Propagation Delay @ V, Max C L:34ns @ 6V, 50pF
- Current - Quiescent ( Iq):8 µA
- Trigger Type:Positive Edge
- Input Capacitance:10 pF
- Function:Master Reset
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD54HC173F3A provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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