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Rochester Electronics CD4097BE
Manufacturer # :CD4097BE
Manufacturer :Rochester Electronics
Dasenic # :CD4097BE-DS
Datasheet : CD4097BE Datasheet
Customer # :
Description : IC MUX/DEMUX DUAL 1X8 24DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 7296
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.916
Total :$ 2.92
Delivery :
Payment :
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Rochester Electronics CD4097BE technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Analog Switches, Multiplexers, Demultiplexers
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C (TA)
- Mounting Type:Through Hole
- Package / Case:24-DIP (0.600", 15.24mm)
- Supplier Device Package:24-PDIP
- Number of Circuits:2
- Multiplexer/ Demultiplexer Circuit:8:1
- Switch Circuit:-
- On- State Resistance ( Max):240Ohm
- Voltage - Supply, Single ( V+):3V ~ 18V
- Voltage - Supply, Dual ( V±):-
- -3db Bandwidth:20MHz
- Channel-to- Channel Matching (Δ Ron):5Ohm
- Switch Time ( Ton, Toff) ( Max):-
- Charge Injection:-
- Channel Capacitance ( C S(off), C D(off)):0.2pF, 35pF
- Current - Leakage ( I S(off)) ( Max):100nA
- Crosstalk:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CD4097BE provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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