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1 : $3.3930
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Rochester Electronics CD22101F3A
4 X4 XPOINT SWITCH WITH MEMORY
Manufacturer # :CD22101F3A
Manufacturer :Rochester Electronics
Dasenic # :CD22101F3A-DS
Datasheet :
CD22101F3A Datasheet
CD22101F3A DatasheetCustomer # :
Description : 4 X4 XPOINT SWITCH WITH MEMORY
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 3.3930 | $ 3.39 |
| 25+ | $ 3.3210 | $ 83.03 |
| 100+ | $ 3.1860 | $ 318.6 |
| 500+ | $ 3.0510 | $ 1525.5 |
| 1000+ | $ 2.8800 | $ 2880 |
In Stock: 1836
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.393
Total :$ 3.39
Delivery :
Payment :
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CD22101F3A information
Rochester Electronics CD22101F3A technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Through Hole
- Package / Case:24-CDIP (0.600", 15.24mm)
- Type:Crosspoint Switch
- Supplier Device Package:24-CERDIP
- Voltage - Supply:3V ~ 18V
- Voltage Supply Source:Dual Supply
- Current - Output High, Low:-
- Circuit:4 x 4:2
- Independent Circuits:1
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- HTS US:0000.00.0000
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD22101F3A provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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