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Rochester Electronics CC430F6125IRGC
Manufacturer # :CC430F6125IRGC
Manufacturer :Rochester Electronics
Dasenic # :CC430F6125IRGC-DS
Datasheet : CC430F6125IRGC Datasheet
Customer # :
Description : IC RF TXRX+MCU ISM<1GHZ 64VFQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1940
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.501
Total :$ 3.50
Delivery :
Payment :
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CC430F6125IRGC information
Rochester Electronics CC430F6125IRGC technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Discontinued at Digi-Key
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:64-VFQFN Exposed Pad
- Frequency:300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz
- Type:TxRx + MCU
- Sensitivity:-117dBm
- Supplier Device Package:64-VQFN (9x9)
- Data Rate ( Max):500kBaud
- Memory Size:16kB Flash, 2kB SRAM
- Voltage - Supply:2V ~ 3.6V
- Power - Output:13dBm
- Protocol:-
- Serial Interfaces:I²C, IrDA, JTAG, SPI, UART
- R F Family/ Standard:General ISM < 1GHz
- Current - Receiving:15mA ~ 18.5mA
- Modulation:2FSK, 2GFSK, ASK, MSK, OOK
- G P I O:44
- Current - Transmitting:15mA ~ 36mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A002A1 TI
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CC430F6125IRGC provided by Rochester Electronics
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Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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