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Rochester Electronics CC2510F16RSP
IC RF TXRX+MCU ISM>1GHZ 36-VFQFN
Manufacturer # :CC2510F16RSP
Manufacturer :Rochester Electronics
Dasenic # :CC2510F16RSP-DS
Datasheet :
CC2510F16RSP Datasheet
CC2510F16RSP DatasheetCustomer # :
Description : IC RF TXRX+MCU ISM>1GHZ 36-VFQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 9.1902 | $ 91.9 |
| 490+ | $ 7.6585 | $ 3752.67 |
In Stock: 1195
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.1902
Total :$ 9.19
Delivery :
Payment :
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CC2510F16RSP information
Rochester Electronics CC2510F16RSP technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Discontinued at Digi-Key
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:36-VFQFN Exposed Pad
- Frequency:2.4GHz
- Type:TxRx + MCU
- Sensitivity:-103dBm
- Supplier Device Package:36-VQFN (6x6)
- Data Rate ( Max):500kBaud
- Memory Size:16kB Flash, 2kB SRAM
- Voltage - Supply:2V ~ 3.6V
- Power - Output:1dBm
- Protocol:-
- Serial Interfaces:I²S, SPI, USART
- R F Family/ Standard:General ISM > 1GHz
- Current - Receiving:14.7mA ~ 22.9mA
- Modulation:2FSK, GFSK, MSK
- G P I O:21
- Current - Transmitting:15.5mA ~ 26mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A002A1 TI
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CC2510F16RSP provided by Rochester Electronics
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As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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