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Rochester Electronics CC1110F32RSP
Manufacturer # :CC1110F32RSP
Manufacturer :Rochester Electronics
Dasenic # :CC1110F32RSP-DS
Datasheet : CC1110F32RSP Datasheet
Customer # :
Description : IC RF TXRX+MCU ISM<1GHZ 36QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 5280
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.438
Total :$ 3.44
Delivery :
Payment :
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CC1110F32RSP information
Rochester Electronics CC1110F32RSP technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Discontinued at Digi-Key
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:36-VFQFN Exposed Pad
- Frequency:300MHz ~ 348MHz, 391MHz ~ 464MHz, 782MHz ~ 928MHz
- Type:TxRx + MCU
- Sensitivity:-112dBm
- Supplier Device Package:36-VQFN (6x6)
- Data Rate ( Max):500kBaud
- Memory Size:32kB Flash, 4kB SRAM
- Voltage - Supply:2V ~ 3.6V
- Power - Output:10dBm
- Protocol:-
- Serial Interfaces:I²S, USART
- R F Family/ Standard:General ISM < 1GHz
- Current - Receiving:16.2mA ~ 21.5mA
- Modulation:2FSK, ASK, GFSK, MSK, OOK
- G P I O:21
- Current - Transmitting:18mA ~ 36.2mA
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CC1110F32RSP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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