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  • Rochester Electronics CC1100-RTY1

    IC RF TXRX ISM<1GHZ 20VFQFN
  • part number has RoHS
  • Mfr.Part # :CC1100-RTY1
  • Manufacturer :Rochester Electronics
  • Dasenic # :CC1100-RTY1-DS
  • Datasheet :pdf download CC1100-RTY1 Datasheet
  • Description : IC RF TXRX ISM<1GHZ 20VFQFN
  • Package :-
  • Quantity :
    Unit Price : $ 10.4138Total : $ 10.41
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1261
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
184 +$ 10.4138$ 1916.14

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Rochester Electronics CC1100-RTY1 technical specifications, attributes, parameters.
Category:RF and Wireless/RF Transceiver ICs
Product Status:Not For New Designs
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:20-VFQFN Exposed Pad
Frequency:300MHz ~ 348MHz, 400MHz ~ 464MHz, 800MHz ~ 928MHz
Type:TxRx Only
Sensitivity:-111dBm
Supplier Device Package:20-QFN (4x4)
Data Rate ( Max):500kBaud
Memory Size:-
Voltage - Supply:1.8V ~ 3.6V
Power - Output:10dBm
Protocol:-
Serial Interfaces:SPI
R F Family/ Standard:General ISM < 1GHz
Current - Receiving:13.9mA ~ 15.9mA
Modulation:2FSK, ASK, GFSK, MSK, OOK
G P I O:1
Current - Transmitting:12.3mA ~ 31.1mA
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Green Symbol: Green and environmentally friendly product
CC1100-RTY1 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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